: a) Post-Etch b) Backside/Bevel Etch & Clean Handling: a) Cassette Interface: Smif INX2200 b) Swivel Lever: Backside Handling with ECO gripper Process Module a) Chuck Type: Pin Chuck no undercutt Environment: a) No (FFU) b) Exhaust: 158 Exhaust Up, 266/267 exhaust down, all Bottom Fed c) Exhaust Material: PP d) Drain Direction: Down Chemical Supply: a) MED2: HF50% MED3: Polyetch b) Gas Supply: MFM (N2 Chuck) c) Vacuum for wafer handling